Mesoscale Simulation of Shape Memory Alloy Film Damping
Seyed Shahabeddin Ahmadi
WW8, FAU
Wednesday, 14.03.2018, 18:00
WW8, Room 2.018-2, Dr.-Mack-Str. 77, Fürth
The vibration-damping performance of pseudoelastic shape memory alloy (SMA) film devices is investigated under non-isothermal conditions on a mesoscopic (micrometer) scale and correlated with the performance on the macro (device) scale. SMA materials are predestined for damping of vibration and shock impacts due to their high work density. Here, we investigate the passive damping performance of TiNi thin-film–based bridge structures for the cases of free and forced vibration. The investigation is based on a thermodynamics-based Gibbs free energy model that includes a martensite-austenite interface free energy term using formulations from a phase-field model. The dynamics performance of the mass of the system is represented by a differential equation and coupled to the finite element domain as a boundary condition.